Wafer cutting machine RNV-2000 is designed for confectionery industry. It is used for cutting one or more prepared wafer slabs into their final shapes and sizes, according to technological needs and customer's requests. While cutting several slabs simultaneously, the number of slabs is set on the counter. Inside of the cutter are a conveyor, which delivers wafer slabs, and a mechanism for counting and piling slabs. Both the counting and piling mechanism and the conveyor are equipped with photocells and electro-pneumatic elements so the cutting and piling become completely automatic operations. The machine is controlled by controller, which enables it to be connected to the production line or to work independently. The work on the machine consists of supervision, if the machine is connected to the production line, or providing slabs, if it is working independently.
Technical data
Machine dimensions: 2100 x 1620 x 1250 mm
Machine weight: 450 kg
Capacity: 15-25 slabs/min
Electrical connection: 380 V, 50 Hz
Compressed air supply: 6 bar
Compressed air consumption: 200 Nl/min
Power consumption: 1,5 kW
